陶瓷基板的研磨機(jī)的原理是什么Multi functional vacuum hole plug machine manufacturer

陶瓷基板研磨機(jī)的原理主要基于機(jī)械摩擦與材料去除的協(xié)同作用，通過(guò)精密控制的研磨工具與陶瓷基板表面的相對(duì)運(yùn)動(dòng)，實(shí)現(xiàn)高精度、低損傷的表面加工。其核心原理可分解為以下關(guān)鍵環(huán)節(jié)：

1. 研磨介質(zhì)與作用力

• 研磨工具：通常采用金剛石、碳化硅（SiC）或氧化鋁（Al?O?）等超硬材料制成的磨盤(pán)或磨粒，其硬度遠(yuǎn)高于陶瓷基板（如氧化鋁、氮化鋁、氧化鋯等），確保有效去除材料。

• 作用力類型：

  • 法向力：垂直于基板表面的壓力，使磨粒嵌入基板表面，產(chǎn)生塑性變形或脆性斷裂。

  • 切向力：平行于表面的摩擦力，驅(qū)動(dòng)磨粒滑動(dòng)或滾動(dòng)，剝離破碎的材料層。

  
  

2. 材料去除機(jī)制

陶瓷基板的研磨過(guò)程結(jié)合了脆性斷裂與塑性流動(dòng)兩種機(jī)制，具體取決于材料特性、研磨參數(shù)及磨粒尺寸：

• 脆性斷裂：陶瓷為脆性材料，當(dāng)磨粒壓入表面時(shí)，裂紋在基板內(nèi)部擴(kuò)展并交匯，導(dǎo)致小塊材料剝落（微破碎）。此機(jī)制在粗研磨階段占主導(dǎo)。

• 塑性流動(dòng)：通過(guò)優(yōu)化研磨參數(shù)（如低壓力、小磨粒、高轉(zhuǎn)速），可使陶瓷表面產(chǎn)生局部塑性變形，形成光滑層（類似金屬的切削加工）。此機(jī)制在精研磨階段更顯著，可減少表面損傷。

3. 運(yùn)動(dòng)方式與軌跡控制

研磨機(jī)通過(guò)精確控制研磨工具與基板的相對(duì)運(yùn)動(dòng)，實(shí)現(xiàn)均勻材料去除：

• 單軸旋轉(zhuǎn)研磨：磨盤(pán)繞固定軸旋轉(zhuǎn)，基板固定或做行星運(yùn)動(dòng)，適用于平面研磨。

• 雙軸聯(lián)動(dòng)研磨：磨盤(pán)與基板同時(shí)旋轉(zhuǎn)（如自旋轉(zhuǎn)研磨），通過(guò)調(diào)整轉(zhuǎn)速比優(yōu)化表面均勻性。

• 軌跡規(guī)劃：通過(guò)數(shù)控系統(tǒng)控制磨盤(pán)或基板的擺動(dòng)、振動(dòng)或往復(fù)運(yùn)動(dòng)，避免局部過(guò)度研磨，提升表面平整度。

4. 冷卻與潤(rùn)滑系統(tǒng)

• 冷卻液作用：

  • 散熱：研磨產(chǎn)生大量熱量，冷卻液（如水基或油基溶液）可防止基板熱變形或磨粒鈍化。

  • 排屑：攜帶研磨碎屑離開(kāi)加工區(qū)，避免二次劃傷。

  • 潤(rùn)滑：減少磨粒與基板間的摩擦，降低表面粗糙度。

  
  

• 噴淋方式：通過(guò)噴嘴均勻噴射冷卻液，或采用浸沒(méi)式研磨（基板完全浸入冷卻液中）。

5. 工藝參數(shù)優(yōu)化

• 研磨壓力：壓力過(guò)大易導(dǎo)致裂紋擴(kuò)展，壓力過(guò)小則效率低下，需根據(jù)材料硬度調(diào)整。

• 磨粒尺寸：粗磨用大顆粒（如#200-#400），精磨用小顆粒（如#1000以上），逐步降低表面粗糙度。

• 研磨速度：高轉(zhuǎn)速可提高效率，但需平衡離心力對(duì)加工穩(wěn)定性的影響。

• 加工時(shí)間：通過(guò)在線檢測(cè)（如激光干涉儀）實(shí)時(shí)監(jiān)控表面質(zhì)量，避免過(guò)度研磨。

6. 表面質(zhì)量提升技術(shù)

• 化學(xué)機(jī)械拋光（CMP）：在研磨液中添加化學(xué)試劑（如酸性或堿性溶液），通過(guò)化學(xué)反應(yīng)軟化陶瓷表面，結(jié)合機(jī)械作用實(shí)現(xiàn)超光滑加工（Ra<0.1μm）。

• 超聲波輔助研磨：利用高頻振動(dòng)使磨粒產(chǎn)生微沖擊，改善材料去除均勻性，尤其適用于難加工陶瓷。

應(yīng)用場(chǎng)景

陶瓷基板研磨機(jī)廣泛應(yīng)用于電子封裝、功率器件、LED照明等領(lǐng)域，用于制備高平整度、低粗糙度的基板表面，以滿足后續(xù)金屬化、芯片貼裝等工藝要求。例如，氮化鋁（AlN）基板需通過(guò)研磨去除燒結(jié)缺陷，確保高導(dǎo)熱性與絕緣性。

通過(guò)上述原理的協(xié)同作用，陶瓷基板研磨機(jī)能夠?qū)崿F(xiàn)納米級(jí)表面粗糙度控制，同時(shí)保持基板的機(jī)械強(qiáng)度與電學(xué)性能，是高端陶瓷電子器件制造的關(guān)鍵設(shè)備。

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What are the advantages of vacuum plug hole machine? 1. Selective plugging can be performed; 2. Completely solve the problems of bubbles and voids in high aspect ratio boards; 3. The aspect ratio can reach 1:30; 4. Automated operation interface, user-friendly, and easy to operate; The vacuum plug hole machine is used for the process of plugging conductive and non-conductive resin ink holes. After plugging, the holes are full, without depressions or bubbles. Suitable for selective through-hole, blind hole, back drilling and other types of plug hole processes. Suitable for silver paste, copper paste, conductive adhesive, imported and domestic resin ink. The vacuum plug hole machine can complete all the holes that need to be plugged at once without any large or small hole requirements. In addition, it is equipped with a scraper that can scrape off excess resin on the surface, reducing the difficulty of grinding. What are the characteristics of the control system of the vacuum plug hole machine? Multi functional vacuum hole plug machine manufacturer

In the process of producing and manufacturing PCB boards, some PCB boards need to be plugged. The traditional production method is to use screen printing to place resin or other required working materials on the PCB mesh board and cooperate with a scraper or scraper to move back and forth, inserting resin and other materials into the holes of the PCB board. However, this method may not be able to quickly and accurately fill the required materials into the holes due to the influence of bubbles when the hole diameter becomes smaller, the board becomes thicker, or even blind holes. In addition, there may be air or bubbles in the filled working material, which can easily cause the working material in the holes to bulge, sink or be discontinuous. Therefore, vacuum plugging machines are generally used now. PCB that will require plug holes The board is placed in the vacuum chamber, and after the vacuum unit is evacuated, the silk screen plug hole mechanism in the vacuum chamber is used to quickly and accurately fill the holes. The excess ink is scraped back to the starting position using a return oil scraper, and then the PCB board is removed through the table sealing conversion mechanism. By using vacuum plug holes, the original defects such as bubbles, dents, or discontinuities are avoided. The Zhuhai copper paste vacuum plug machine is recommended to ensure that there are no bubbles generated during resin plug hole printing.

What is the function of using a vacuum plug hole machine for PCB circuit boards? In the process of designing PCB circuit boards, although the size of solder pads and vias will gradually decrease, if the board thickness is not proportionally reduced, it will increase the aspect ratio of vias, leading to a decrease in reliability. Due to the advancement of laser drilling technology and plasma dry etching technology, smaller blind holes and buried holes can be manufactured. If the diameter of these non through holes is 0.3mm, the parasitic parameters will be about 1/10 of the original conventional holes, significantly enhancing the reliability of the PCB. Due to the adoption of non through-hole technology, there will be fewer large holes and larger spacing for PCB wiring. The remaining space can be used for large-area shielding to improve EMI/RFI performance. In addition, more remaining space can also be used in the inner layer to partially shield equipment and critical network cables, thereby improving electrical performance. The use of non through holes makes it easier for component pins to fan out, which helps high-density pin devices (such as BGA packaging devices) to trace and reduce wiring length, meeting the timing requirements of high-speed circuits.

With the development of electronic products towards "light, thin, short, and small" direction, PCBs are also developing towards high density and high difficulty, resulting in a large number of SMT and BGA PCBs. Customers require plug holes when mounting components, and vacuum plug hole machines can be used for PCBs. The specific functions are as follows: 1. To prevent short circuits caused by tin passing through the component surface through the via holes during PCB wave soldering; Especially when we place vias on BGA pads, we must first make plug holes and then gold plating to facilitate BGA soldering. 2. Avoid leaving solder flux in the conductive holes; 3. After the surface mount and component assembly of the electronic factory are completed, the PCB needs to be vacuumed on the testing machine to form negative pressure before it can be completed; 4. Prevent surface solder paste from flowing into the holes and causing virtual soldering, which may affect the mounting process; 5. Prevent tin beads from popping out during wave soldering, causing short circuits. The vacuum plug hole machine is suitable for resin ink, silver paste, copper paddle, and conductive adhesive.

The function of the vacuum plug hole machine is to fix the circuit board and mesh board to the horizontal plug hole platform with a fixture. After the vacuum door is closed, start vacuuming. Vacuumize for about fifteen seconds to reach the vacuum level! The piston controlled by air pressure squeezes ink through the mesh plate into the holes on the plate. The ink is placed in a reusable ink holder. Different sizes of boards can use different sizes of plug heads! The vertical movement is controlled by a servo motor. All process parameters can be saved as menus, and the touch screen display can store up to fifty menus! The working principle of the vacuum plug hole machine: Ink can be placed in standard 12 ounce or 6 ounce or smaller ink cartridges! The ink in the ink holder is compressed into the plug hole head by a pneumatic pressure piston. This machine can use different plug sizes, but if the plug size is larger than six inches, a larger pressure system must be used to evenly deliver ink to every part of the 24 inch plug. The vacuum plug hole machine can complete all the holes that need to be plugged at once, without any large or small hole requirements. Zhuhai Resin Hole Plug Machine Company

What are the advantages of vacuum plug hole machine? Multi functional vacuum hole plug machine manufacturer

The mechanism of the vacuum resin plugging machine is that during the plugging process, the resin constantly comes into contact with air, and the air is trapped inside the resin, causing it to stay in the hole after plugging. For screen plug holes, due to the resin being dispersed through the screen and then merged when entering the holes, the number of bubbles in the plug holes is relatively higher than that in aluminum sheet plug holes. For vacuum plugging machines, the plugging process is in a vacuum state, and the resin does not come into contact with air. There are no bubbles trapped in the resin, so no plugging bubbles are generated. Of course, the so-called vacuum is not necessarily true. In fact, there are still trace amounts of air, and during the resin recovery process, there is manual stirring, which can also introduce trace bubbles into the resin. Therefore, if the resin is reused without defoaming, there will also be a small amount of air bubbles in the vacuum plug hole. Multi functional vacuum hole plug machine manufacturer